Caliber Interconnect solutions is one of the leading providers of test services for semiconductor ICs with a myriad of end-use applications such as: communication, consumer electronics, automobile, security, industrial and medical. Our experience working across multiple industry has enabled us to develop bespoke processes to aid in the rapid test bring up to reduce the time to market and the cost.

We offer a wide range of offerings under one roof to provide customers with the full-turnkey manufacturing solutions, including: Probe card design, Wafer sorting, packaging solutions, Load board, Test engineering solutions, Post production support etc., Additionally, we have cultivated relationship with service partners across strategic locations in the world including in Taiwan, Vietnam, China to enhance our value offerings and provide seamless support to customers which include Bump, FAN-In and FAN-Out WLCSP, 3D Embedded Substrate Manufacturing and Burn-In.

Test Solutions:

Caliber Interconnect has invested in a state of art test house with testers installed from Advantest and simulators from multiple vendors for the accelerated test bring up of most advanced chips supported by technically proficient test engineers with the deep knowledge and insights about different device types including analog, mixed signal, logic, memory, CMOS image sensors, accelerometer MEMS sensors, radio frequency (RF) for radar, near field communications (NFC) and other RFID devices. Our test solutions include wafer probe (ambient, hot and cold), final test, reliability testing and failure analysis.

We have a centralized test development team providing development services to customers worldwide. Our test development engineers work closely with customers to reduce costs and streamline process flows by ensuring test programs are optimized with the most effective test coverage and enable the shortest test times.

We offer

  • Testing Engineering solution for Analog, Logic Memory, Mixed-Signal, RF and MEMS products for world-wide customer base.
  • Developing Testing solution for new prototype Silicon Design.
  • Improving program test time, test yield and recommending new test methodology.
  • Assist Test cost reduction:
  • Provide single to multi-sites program conversion
  • Migration test program to lower cost platform
  • Development and Conversion of test programs across different test platforms.
  • Dedicated Test Development engineering group, in India and Singapore

Mixed Signal Logic and Analog

  • Products: SERDES, SATA, Gigabit Ethernet, Storage, Graphics, Multimedia, USB, Firewire, Telecom, Power management, Automotive, ADSL, North/South Bridges, Controller & Flash, Codec, NFC, Protection.

Production Consideration

  • Up to 16/32 sites testing. (128 sites for MEMs)
  • Support Device Characterization at cold, room & hot for automotive requirement.

Vector Conversion

  • Translate CAE pattern files (eVCD & WGL)


  • Support reliability, burn in, HTOL, HTOS services.
  • Silicon characterization include corner wafers & engineering sample.
  • Pilot production lots, determine/improving yield and test stability.
  • Provide rental engineering tester hours.

Tools and Test Platform Expertise

  • Advantest (Verigy) 93K
  • Advantest T2K
  • Teradyne J750
  • Teradyne Flex
  • Teradyne Eagle